Position Summary

As an RF & Photonics Packaging Engineer, you will be responsible for developing Lightium’s Packaging technologies, chip assemblies, as well as supply chain management. You will have the opportunity to leverage your theoretical knowledge and your prior experience in the field of RF and photonics packaging by managing Lightium’s packaging activities and to interface to Lightium’s internal and external customers. You will be responsible for ensuring Lightium’s TFLN chips can be packaged according to our customer’s specification and will drive the implementation of novel packaging concepts with Lightium’s suppliers. You will have the opportunity to work on cutting-edge packaging technologies, such as flip chip bonding, ribbon bonding, microtransfer printing, etc.

Key Responsibilities

Packaging concepts: You will be actively working with the different internal R&D groups including design, PDK, process development, characterization and test teams to ensure "design for packaging" and "design for testing" is followed in our whole organization. You will identify and implement different packaging concepts compatible with our TFLN technology (e.g., , laser integration, drivers and TIA integration, wire bonding, fiber attachment, etc.) while meeting our customer’s needs. You’ll actively work on ultra-high-speed RF package solutions and simulate the relevant packaging concepts in state-of-the-art electromagnetic simulation tools (such as COMSOL, HFSS, ADS, etc). You’ll also work on fiber-to-chip coupling solutions, spot size converters, and attachment of fiber array units (FAUs).

Supplier identification and management: Lightium and its customers value a multi sourcing strategy. You are responsible that all identified packaging concepts can be sourced from multiple vendors. This includes electrical attach (wire bonding, flip chip bumping and optical fiber and bumping) as well as optical fiber attach. You will drive the diversification of our supply chain including Western, European and Asian suppliers.

Assembly project management: You will drive the day-to-day project management of internal R&D projects, public funded projects and customer assembly projects with external partners, such as assembly houses and OSATs. You will be the point of contact and managing the relationship with packaging houses and OSTAs. You will drive the day-to-day meetings and provide regular updates to Lightum's management. You will define the packaging specs, budget, and timeline for the subcontractors. You will make sure that the assemblies are delivered on time, in spec and in budget to our customers while matching our demanding RF and optical requirements. You will coordinate with Lightium’s R&D team for any package-level testing, characterization, and qualification.

Customer engagement: Based on customer requirements, you will identify and implement the matching assembly technologies and concepts. You will track the requirements with a keen eye to detail and make sure all specifications are met and traceable. In this role, you will have the unique opportunity to work with leading transceiver manufacturers and OSATs.

Reliability and Quality: You will define the qualification plans and qualification procedures for our packaging concepts. You will work with internal and external stakeholders to run the qualifications, such as environmental reliability or electrical stress tests. In the case of RMA events, you will support the team inassembly-related aspects and embrace customer satisfaction.

Collaboration: Work closely with the R&D teams from design to optical testing and characterization, contributing to cross-functional projects to advance our packaging platforms. Occasional travel to Lightium’s assembly partners and OSATs. Participating in public funded projects (HorizonEurope, InnoSuisse, European Chips Act etc.) to develop new packaging concepts and hybrid integration solutions.

Documentation and Reporting: Maintain thorough documentation and report findings, as well as establishing standard-operating procedures and training new colleagues.

Innovation: Stay up to date on the latest advancements in photonics, incorporating new techniques and technologies into our R&D landscape. Identification of packaging IP and contributing to Lightium’s IP portfolio.

What you’ll bring

Educational Background: An advanced degree in Electrical Engineer, Physics, Electro-Optical or Wireless Communications, Integrated Photonics, Chemistry, Material Science or a related field.

Experience Level: At least 3 years' work experience (post-graduation) in the field of electronics, photonics, electronic packaging, PCB manufacturing, material science or RF design. Track record of moving electro-optical assemblies from concept over prototyping into production.

Technical Skills: Prior experience with photonic packaging concepts, fiber attach, electronic re-distributing layers (RDLs), under-bump metallization (UBM), bumping, copper pillars or anisotropic conductive glue (ACF) is a plus. Experience in the field of RF simulations (COMSOL, Keysight ADS, Ansys, HFSS and CST) is a clear advantage. Experience with intermetallic phases and SEM-EDX is advantageous.

Organization & Documentation: Strong organizational skills with excellent project management skills and a keen eye for details. Experience handling and documenting RMA processes, in outward-facing communication with suppliers and subcontractors at international level.

Collaboration: Excellent communication skills and the ability to communicate effectively in a multidisciplinary team and with international customers. Cultural awareness and tailoring of communication style to US, European and Asian partners. Experience with vendor and supplier management at an international level.